A universal packaging substrate for mechanically stable assembly of stretchable electronics

Area of Science:

• Materials Science
• Polymer Science
• Electronics Engineering

Background:

• Stretchable electronics integrate diverse modules, facing challenges with strain-induced delamination due to varied material properties.
• Maintaining stable interfaces between modules and packaging substrates is crucial for device reliability.

Purpose of the Study:

• To develop a versatile packaging substrate for stretchable electronics that ensures mechanically stable interfaces for various module types.
• To overcome the challenge of strain-induced delamination in stretchable electronic devices.

Main Methods:

• Engineered a polymer matrix with regionally tuned bulk molecular mobility and surface molecular polarity.
• Introduced module-specific stretchability and universal adhesiveness into the substrate design.
• Tested substrate performance with stiff and stretchable modules under high strain conditions (up to 600%).

Main Results:

• The developed substrate provides mechanically stable interfaces for a wide range of modules with different moduli and surface chemistries.
• The substrate successfully prevented delamination even under 600% stretching.
• Fabricated a fully stretchable bioelectronic device (respiration sensor/electric generator) with a 10-week in vivo lifetime.

Conclusions:

• The novel packaging substrate offers a versatile platform for assembling robust stretchable electronic devices.
• The substrate's design enables customized deformation and universal adhesion, significantly improving device durability.
• This approach paves the way for advanced, reliable, and long-lasting stretchable bioelectronic systems.