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A Simple and Scalable Fabrication Method for Organic Electronic Devices on Textiles

A Simple and Scalable Fabrication Method for Organic Electronic Devices on Textiles

Published on: March 13, 2017

A universal packaging substrate for mechanically stable assembly of stretchable electronics.

Yan Shao^1,2, Jianfeng Yan¹, Yinglin Zhi¹

¹Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, 518055, China.

Nature Communications

|July 19, 2024

Summary

Researchers developed a novel packaging substrate for stretchable electronics, enhancing mechanical stability and adhesion between diverse material modules and the substrate. This innovation prevents delamination, enabling robust and versatile device applications.

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Published on: December 23, 2013

Area of Science:

Materials Science
Polymer Science
Electronics Engineering

Background:

Stretchable electronics integrate diverse modules, facing challenges with strain-induced delamination due to varied material properties.
Maintaining stable interfaces between modules and packaging substrates is crucial for device reliability.

Purpose of the Study:

To develop a versatile packaging substrate for stretchable electronics that ensures mechanically stable interfaces for various module types.
To overcome the challenge of strain-induced delamination in stretchable electronic devices.

Main Methods:

Engineered a polymer matrix with regionally tuned bulk molecular mobility and surface molecular polarity.
Introduced module-specific stretchability and universal adhesiveness into the substrate design.
Tested substrate performance with stiff and stretchable modules under high strain conditions (up to 600%).

Main Results:

The developed substrate provides mechanically stable interfaces for a wide range of modules with different moduli and surface chemistries.
The substrate successfully prevented delamination even under 600% stretching.
Fabricated a fully stretchable bioelectronic device (respiration sensor/electric generator) with a 10-week in vivo lifetime.

Conclusions:

The novel packaging substrate offers a versatile platform for assembling robust stretchable electronic devices.
The substrate's design enables customized deformation and universal adhesion, significantly improving device durability.
This approach paves the way for advanced, reliable, and long-lasting stretchable bioelectronic systems.