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Published on: May 24, 2020
Prediction of IGBT Gate Oxide Layer's Performance Degradation Based on MultiScaleFormer Network
Shilie He1,2,3, Meiling Yu4, Yiqiang Chen2,3
1School of Aeronautics, Northwestern Polytechnical University, Xi'an 710072, China.
Monitoring insulated gate bipolar transistor (IGBT) gate oxide degradation using gate leakage current is feasible. The novel MultiScaleFormer model accurately predicts IGBT performance degradation, outperforming other methods with a low MAE of 0.0087.
Area of Science:
- Power Electronics
- Reliability Engineering
- Machine Learning
Background:
- Insulated gate bipolar transistors (IGBTs) are critical in power electronics, with gate oxide degradation being a key failure mode.
- Effective health management requires accurate prediction of IGBT performance degradation.
Purpose of the Study:
- To identify a reliable precursor for IGBT gate oxide degradation.
- To develop and validate an advanced degradation prediction model for IGBTs.
Main Methods:
- Gate leakage current was selected as the fault precursor parameter.
- Feature selection and fusion techniques (time domain analysis, grayscale correlation, Mahalanobis distance, Kalman filter) were employed.
- An improved degradation prediction model, MultiScaleFormer, inspired by iTransformer, was developed.
Main Results:
- A health indicator was successfully extracted to characterize IGBT gate oxide aging.
- MultiScaleFormer demonstrated superior fitting accuracy compared to LSTM, CNN, SVR, GPR, CNN-LSTM, and Transformer models.
- The MultiScaleFormer model achieved a mean absolute error (MAE) as low as 0.0087.
Conclusions:
- Gate leakage current is a feasible fault precursor for IGBT gate oxide failure.
- The MultiScaleFormer model offers a feasible and accurate approach for predicting IGBT performance degradation.
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