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Updated: Jun 14, 2025

Fabrication of Uniform Nanoscale Cavities via Silicon Direct Wafer Bonding
Published on: January 9, 2014
Metastable phases of Ag-Si: amorphous Si and Ag-nodule mediated bonding
Koji S Nakayama1, Masahiko Nishijima2, Yicheng Zhang2
1F3D, The Institute of Scientific and Industrial Research, Osaka University, 8-1 Mihogaoka, Ibaraki, Osaka, 567-0047, Japan. kojisn@sanken.osaka-u.ac.jp.
Abstract:
Metastable phases such as supersaturated solid solutions, supercooling, and amorphous phases are well-known in metallurgy. They are often composed in non-equilibrium states and can be transformed into a stable phase by overcoming an energy barrier with driving forces. Particularly, it has been widely used for material strengthening and heterogeneous nucleation of precipitates in solids is mainly induced by heat treatments for supersaturated solid solutions. However, little is known about the metastable phases of the Ag-Si alloy, although it is a well-known simple binary eutectic alloy. Here, we show that the metastable phases composed of amorphous Si and supersaturated Ag solid solution are induced by the eutectic reaction under rapid cooling of Ag-Si. Furthermore, the solute Si in the Ag matrix reacts with oxygen to precipitate Ag by-products, which grow as nodules. The Ag nodules have high crystallinity and robust interfacial structures, and the nodule growth leads to the formation of cross-links between the Ag-Si particles. We also demonstrate the Ag nodule-mediated bonding where the rapidly cooled Ag-Si ribbon is directly used as a bonding medium, indicating the possibility of using it as a high-temperature bonding material with low-temperature processes.

