Highly Interconnected Thermal Conduction Highway for Highly Thermally Conductive and Mechanically Strong Polymeric...

Area of Science:

• Materials Science
• Polymer Science
• Nanotechnology

Background:

• Polymers have low intrinsic thermal conductivity (TC), limiting their use in thermal management.
• High-performance composites often require expensive fillers and face processing challenges at high filler loadings.

Purpose of the Study:

• To develop a straightforward fabrication method for high TC polymeric composites.
• To create a programmed internal structure, termed a highly interconnected thermal conduction highway (HITCH).
• To optimize composite TC and mechanical properties while minimizing filler usage.

Main Methods:

• Incorporating partially cured resin fragments into conventional filler/resin mixtures.
• Systematically tuning variables like resin fragment concentration, filler (hexagonal boron nitride - hBN) concentration, and fragment packing density.
• Characterizing the thermal conductivity and tensile strength of the fabricated composites.

Main Results:

• Achieved a 2.6-fold TC enhancement (6.5 W/mK) compared to conventional composites at similar hBN concentrations (∼2.5 W/mK).
• Developed a composite with high TC (∼12 W/mK) and good tensile strength (∼22.6 MPa).
• Successfully fabricated a high-performance composite using a minimal filler content (∼34 wt %).

Conclusions:

• The HITCH fabrication method offers an efficient route to enhance TC in polymeric composites.
• The approach allows for significant TC improvement with reduced filler loading, addressing cost and processing limitations.
• This study provides a framework for developing advanced materials for future thermal management systems.