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Experimental Methods for Investigation of Shape Memory Based Elastocaloric Cooling Processes and Model Validation
Published on: May 2, 2016
A novel machine learning workflow to optimize cooling devices grounded in solid-state physics
Julian G Fernandez1,2, Guéric Etesse3, Natalia Seoane4
1Centro Singular de Investigación en Tecnoloxías Intelixentes, USC, 15782, Santiago de Compostela, Spain. popingarcia@gmail.com.
Abstract:
Cooling devices grounded in solid-state physics are promising candidates for integrated-chip nanocooling applications. These devices are modeled by coupling the quantum non-equilibirum Green's function for electrons with the heat equation (NEGF+H), which allows to accurately describe the energetic and thermal properties. We propose a novel machine learning (ML) workflow to accelerate the design optimization process of these cooling devices, alleviating the high computational demands of NEGF+H. This methodology, trained with NEGF+H data, obtains the optimum heterostructure designs that provide the best trade-off between the cooling power of the lattice (CP) and the electron temperature ([Formula: see text]). Using a vast search space of [Formula: see text] different device configurations, we obtained a set of optimum devices with prediction relative errors lower than [Formula: see text] for CP and [Formula: see text] for Te. The ML workflow reduces the computational resources needed, from two days for a single NEGF+H simulation to 10 s to find the optimum designs.
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