Search research articles

ABOUT JoVE

Overview Leadership Blog JoVE Help Center

AUTHORS

Publishing Process Editorial Board Scope & Policies Peer Review FAQ Submit

LIBRARIANS

Testimonials Subscriptions Access Resources Library Advisory Board FAQ

RESEARCH

JoVE Journal Methods Collections JoVE Encyclopedia of Experiments Archive

EDUCATION

JoVE Core JoVE Business JoVE Science Education JoVE Lab Manual Faculty Resource Center Faculty Site

Terms & Conditions of Use

Search research articles

Related Experiment Video

Updated: Jun 7, 2025

A Standard and Reliable Method to Fabricate Two-Dimensional Nanoelectronics

A Standard and Reliable Method to Fabricate Two-Dimensional Nanoelectronics

Published on: August 28, 2018

Challenges and opportunities in engineering next-generation 3D microelectronic devices: improved performance and

Niharika Singh¹, Kingshuk Srivastava², Ajay Kumar³

¹Department of Informatics, School of Computer Science, University of Petroleum & Energy Studies Dehradun-248007 Uttarakhand India.

Nanoscale Advances

|November 21, 2024

Related Concept Videos

You might also read

Related Articles

Articles linked to this work by shared authors, journal, and citation graph.

Sort by

Same author

Regulation of Laser-Deposited Silver Microstructures on Ceramic Surfaces and Their Effects on Electrical Conductivity.

Micromachines·2026

Same author

Electrolyte-engineering for enhanced charge storage in Ni metal-organic framework electrodes for high performance supercapacitors.

RSC advances·2026

Same author

Electrolyte-driven modulation of charge storage mechanisms in Co metal-organic frameworks for advanced supercapacitors.

RSC advances·2026

Same author

Multi-Modal Droplet Manipulation on Laser-Patterned Stimulus-Responsive Gradient Surfaces: Enabling Anti-Gravity Climbing.

ACS applied materials & interfaces·2025

Same author

Enhancing Triboelectric Nanogenerator Performance via Ultraviolet Nanosecond Laser-Engineered Microstructured Intermediate Layer.

ACS applied materials & interfaces·2025

Same author

Self-organization of photonic structures in colloidal crystals in the AI era.

Nanoscale advances·2025

Summary

Next-generation 3D microelectronics offer enhanced performance and density for complex applications. Advances in fabrication and novel materials are crucial for overcoming challenges in developing these sophisticated devices.

Area of Science:

Materials Science
Nanotechnology
Microelectronics Engineering

Background:

Traditional 2D microelectronics face limitations with increasing application complexity and power demands.
Nanotechnology and materials science advancements enable the design and fabrication of 3D microelectronic devices.
3D microelectronics offer improved performance, higher integration density, and novel functionalities compared to 2D counterparts.

Purpose of the Study:

To discuss recent advances in the fabrication of next-generation 3D microelectronic devices.
To highlight the importance of novel materials and architectures for advanced microelectronics.
To emphasize the challenges and future directions in 3D microelectronics development.

Main Methods:

Review of recent fabrication techniques for 3D microelectronic devices.

More Related Videos

Planar and Three-Dimensional Printing of Conductive Inks

Planar and Three-Dimensional Printing of Conductive Inks

Published on: December 9, 2011

Bridging the Bio-Electronic Interface with Biofabrication

Bridging the Bio-Electronic Interface with Biofabrication

Published on: June 6, 2012

Related Experiment Videos

Last Updated: Jun 7, 2025

A Standard and Reliable Method to Fabricate Two-Dimensional Nanoelectronics

A Standard and Reliable Method to Fabricate Two-Dimensional Nanoelectronics

Published on: August 28, 2018

Planar and Three-Dimensional Printing of Conductive Inks

Planar and Three-Dimensional Printing of Conductive Inks

Published on: December 9, 2011

Bridging the Bio-Electronic Interface with Biofabrication

Bridging the Bio-Electronic Interface with Biofabrication

Published on: June 6, 2012

Discussion of novel materials and architectures, including monolithic 3D and heterogeneous integration.

Analysis of challenges in achieving higher performance and integration density.

Main Results:

3D microelectronics fabrication has evolved significantly, moving beyond traditional 2D methods.
Novel materials and architectures like monolithic 3D and heterogeneous integration are key to overcoming fabrication hurdles.
Addressing complex issues is vital for enhancing performance and integration density in 3D devices.

Conclusions:

3D microelectronics are essential for meeting the demands of high-performance computing, advanced sensors, and communication systems.
Continued research into materials and fabrication is critical for realizing the full potential of 3D microelectronics.
Overcoming multifaceted challenges will shape the future of microelectronic devices.