Search research articles

ABOUT JoVE

Overview Leadership Blog JoVE Help Center

AUTHORS

Publishing Process Editorial Board Scope & Policies Peer Review FAQ Submit

LIBRARIANS

Testimonials Subscriptions Access Resources Library Advisory Board FAQ

RESEARCH

JoVE Journal Methods Collections JoVE Encyclopedia of Experiments Archive

EDUCATION

JoVE Core JoVE Business JoVE Science Education JoVE Lab Manual Faculty Resource Center Faculty Site

Terms & Conditions of Use

Related Concept Videos

You might also read

Related Articles

Articles linked to this work by shared authors, journal, and citation graph.

Sort by

Same author

A X-Band Integrated Passive Device Structure Based on TMV-Embedded FOWLP.

Micromachines·2025

Same author

Research on Adaptive Closed-Loop Control of Microelectromechanical System Gyroscopes under Temperature Disturbance.

Micromachines·2024

Same author

Mechanical Response of MEMS Suspended Inductors under Shock Using the Transfer Matrix Method.

Micromachines·2023

Same author

Review of Electrothermal Micromirrors.

Micromachines·2022

Same author

Analysis of the Failure and Performance Variation Mechanism of MEMS Suspended Inductors with Auxiliary Pillars under High-g Shock.

Micromachines·2020

Same author

The Effect of Displacement Constraints on the Failure of MEMS Tuning Fork Gyroscopes under Shock Impact.

Micromachines·2019

Search research articles

Related Experiment Video

Updated: Jun 6, 2025

Fabrication and Characterization of Superconducting Resonators

Fabrication and Characterization of Superconducting Resonators

Published on: May 21, 2016

Design and Optimization of a Fan-Out Wafer-Level Packaging- Based Integrated Passive Device Structure for FMCW Radar

Jiajie Yang¹, Lixin Xu¹, Ke Yang¹

¹School of Mechatronical Engineering, Beijing Institute of Technology, Beijing 100081, China.

|November 27, 2024

Summary

This study introduces an optimized integrated passive device (IPD) using fan-out wafer-level packaging (FOWLP) for frequency-modulated continuous wave (FMCW) radar systems, significantly improving performance and reducing noise figure.

Keywords:

electromagnetic simulation fan-out wafer level package integrated passive device optimization surrogate model

More Related Videos

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies

Published on: March 20, 2015

The Microfluidic Probe: Operation and Use for Localized Surface Processing

The Microfluidic Probe: Operation and Use for Localized Surface Processing

Published on: June 4, 2009

Related Experiment Videos

Last Updated: Jun 6, 2025

Fabrication and Characterization of Superconducting Resonators

Fabrication and Characterization of Superconducting Resonators

Published on: May 21, 2016

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies

Published on: March 20, 2015

The Microfluidic Probe: Operation and Use for Localized Surface Processing

The Microfluidic Probe: Operation and Use for Localized Surface Processing

Published on: June 4, 2009

Area of Science:

Electrical Engineering
Microwave Engineering
Radar Systems

Background:

Frequency-modulated continuous wave (FMCW) radar systems require efficient integration of passive components.
Existing integrated passive device (IPD) structures face challenges in accommodating large components like antennas.
Enhancing integration efficiency and performance is crucial for advanced FMCW radar applications.

Purpose of the Study:

To present a novel integrated passive device (IPD) structure based on fan-out wafer-level packaging (FOWLP) for FMCW radar front-end applications.
To introduce a new metric for assessing the impact of IPD structures on the average noise figure in FMCW systems.
To optimize the IPD structure for improved performance, including noise figure and gain.

Main Methods:

Development of a new metric to evaluate the average noise figure in FMCW systems.
Application of support vector machine (SVM) for electromagnetic simulation.
Utilization of the genetic algorithm (GA) for optimization of the IPD structure.
FOWLP technology for device fabrication.

Main Results:

The optimized IPD structure achieves over 35 dB isolation between transmitter and receiver.
The optimized device significantly lowers the average noise figure by 15.2 dB compared to empirical models.
Maximum gain is increased by 4.19 dB.
Optimization reduced computation time from 12 minutes to under 1 millisecond, with full optimization in under 100 seconds.

Conclusions:

The proposed FOWLP-based IPD structure offers enhanced integration efficiency and superior performance for FMCW radar systems.
The novel metric and optimization approach effectively improve key performance parameters like noise figure and gain.
This work paves the way for more compact and higher-performance FMCW radar modules.