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Updated: Sep 18, 2025

Simulation, Fabrication and Characterization of THz Metamaterial Absorbers
Published on: December 27, 2012
Jiajie Yang1, Lixin Xu1, Xiangyu Yin2
1School of Mechatronical Engineering, Beijing Institute of Technology, Beijing 100081, China.
This study presents an integrated passive device (IPD) for X-band FMCW radar using fan-out wafer-level packaging (FOWLP). The novel design and testing demonstrate successful miniaturization for radar applications.
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