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Updated: Jun 5, 2025

Application of a Coupling Agent to Improve the Dielectric Properties of Polymer-Based Nanocomposites
Published on: September 19, 2020
A fully polydicyclopentadiene skeletonized epoxy resin system and its fundamental properties as an electronic
Yuqing Li1,2, Peng Zhao1, Xiongtao Ju1
1School of Chemistry and Chemical Engineering, Jiangsu University, 301 Xuefu Rd, Zhenjiang, 212013, China. zhangjm@ujs.edu.cn.
Abstract:
A low-cost fully dicyclopentadiene (DCPD)-networked epoxy system was designed. Compared to commercial diglycidyl ether of bisphenol-A epoxy resin counterparts, the cured DCPD-based resin demonstrates excellent thermal properties (Tg > 250 °C) and a low dissipation factor (0.0065 at 10 GHz), indicating its potential as a promising thermoset for high-performance electronic applications.
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