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Interface Engineering of 2D Materials toward High-Temperature Electronic Devices.

Wenxin Wang1, Chenghui Wu1, Zonglin Li1

  • 1State Key Laboratory of New Ceramics and Fine Processing, School of Materials Science and Engineering, Tsinghua University, Beijing, 100084, China.

Advanced Materials (Deerfield Beach, Fla.)
|February 18, 2025
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Summary

Two-dimensional materials (2DMs) offer superior high-temperature electronic device performance compared to silicon. Interface engineering is key to unlocking the stability and potential of 2DMs in extreme environments.

Keywords:
2D materialshigh‐temperature electronic devicesinterface engineering

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Area of Science:

  • Materials Science
  • Nanoscience
  • Electrical Engineering

Background:

  • High-temperature electronics are crucial for aerospace, automotive, and drilling industries where cooling is challenging.
  • Traditional silicon and wide-bandgap (WBG) semiconductors face limitations in extreme temperature applications.
  • Two-dimensional materials (2DMs) emerge as promising alternatives for nanoscale high-temperature electronics.

Purpose of the Study:

  • To review advancements in interface engineering for 2D materials in high-temperature electronic devices.
  • To compare the advantages of 2DMs against conventional silicon and WBG semiconductors.
  • To explore strategies for enhancing 2DM stability and device performance at elevated temperatures.

Main Methods:

  • Literature review of recent advancements in 2D material interface engineering.
  • Analysis of strategies for improving thermal stability and electrical performance of 2DMs.
  • Survey of various interface-engineered 2D high-temperature devices (transistors, sensors, etc.).

Main Results:

  • Interface engineering significantly enhances the stability and performance of 2DMs at high temperatures.
  • 2DMs demonstrate superior potential over silicon and WBG semiconductors for high-temperature electronics.
  • Diverse applications of interface-engineered 2D devices, including transistors, optoelectronics, and neuromorphic systems, are highlighted.

Conclusions:

  • Robust interface design is critical for realizing high-performance, stable 2D high-temperature electronics.
  • This review provides fundamental and practical insights into emerging 2D materials for extreme environments.
  • Future research directions in 2D high-temperature electronics are presented.