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Updated: May 15, 2025

Characterization of Thermal Transport in One-dimensional Solid Materials
Published on: January 26, 2014
High through-plane thermal conductivity of graphite films with opened micro-window arrays
Yulun Zhang1, Ke Zhan2, Weiren Fan3
1Institute for Advanced Study, Shenzhen University, Shenzhen 518060, China; Shenzhen Geim Graphene Center (SGC), Tsinghua-Berkeley Shenzhen Institute (TBSI) & Tsinghua Shenzhen International Graduate School (TSIGS), Tsinghua University, Shenzhen 518055, China.
Abstract:
Graphene's ultrahigh in-plane thermal conductivity makes it an ideal material for thermally conductive films in various electronic applications. However, the inherently weak interlayer interaction in conventional graphite films (GrF) results in low through-plane thermal conductivity. Here, we firstly developed a novel structure of opened micro-window arrays in the graphite film (MW-GrF) to significantly enhance the through-plane thermal conductivity by the laser-etching-assisted and micro-origami methods. The opened micro-window arrays are acted as bridges to promote interfacial thermal transport via utilizing the ultrahigh in-plane thermal conductivity of micro-windows, which can achieve a reduction of ∼ 60 % in through-plane thermal resistance, with the lowest value of 0.286 K cm2 W-1. Meanwhile, the through-plane thermal conductivity of MW-GrF was greatly improved to 82.4-89.6 W m-1 K-1 compared to the original GrF with 4.4-6.9 W m-1 K-1. This work provides a simple, scalable and programmable method for finely tailoring the through-plane thermal properties of graphene films, making them promising candidates for highly efficient heat dissipation in future high-power chips.

