Resultant Incidence Angle: A Unique Criterion for Controlling the Inclined Columnar Nanostructure of Metallic Films

Area of Science:

• Materials Science
• Thin Film Deposition
• Nanotechnology

Background:

• The original Glancing Angle Deposition (GLAD) technique, developed for high-vacuum evaporation, assumes substrate tilt angle equals atomic incidence angle.
• Sputtering deposition, with higher pressure and larger sources, deviates from evaporation models, making substrate tilt angle irrelevant for atomic flux description.

Purpose of the Study:

• To establish a universal criterion for describing atomic flux applicable to both evaporation and sputtering deposition techniques.
• To enable precise control over the inclined nanostructure of metallic films regardless of the deposition method.

Main Methods:

• Utilized transport simulations to calculate the resultant incidence angle.
• Investigated ten elements: hcp (Ti, Zr, Hf), bcc (V, Nb, Ta, Cr, Mo, W), and fcc (Al).

Main Results:

• The resultant incidence angle is proposed as a unique criterion relevant to specific deposition conditions.
• Demonstrated the applicability of this criterion across different metallic elements and deposition configurations.
• Presented typical examples of resultant angles for various elements.

Conclusions:

• The resultant incidence angle provides a unified approach to understanding and controlling atomic flux in Glancing Angle Deposition.
• This finding is crucial for advancing the fabrication of inclined nanostructures in metallic films using diverse deposition processes.