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An On-Chip Balun Using Planar Spiral Inductors Based on Glass Wafer-Level IPD Technology.

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This study introduces a compact on-chip transformer balun using integrated passive device (IPD) technology. This miniaturized balun efficiently converts single-ended to differential signals for advanced electronic microsystems.

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IPDglasson-chip balunplanar spiral inductors

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Area of Science:

  • Electrical Engineering
  • Microsystems Engineering
  • Integrated Circuit Design

Background:

  • Advancements in integrated electronic microsystems necessitate miniaturized, high-density components for enhanced performance.
  • Traditional balun designs often face limitations in size and cost for integration into compact systems.

Purpose of the Study:

  • To present a novel on-chip transformer balun utilizing integrated passive device (IPD) technology.
  • To demonstrate a compact and cost-effective solution for single-ended to differential signal conversion on glass substrates.

Main Methods:

  • Integration of planar coupled inductors and filtering capacitors using IPD technology.
  • Fabrication on glass substrates with a flip-chip integration capability.
  • Characterization of performance metrics including return loss, insertion loss, amplitude imbalance, phase difference, and common mode rejection ratio (CMRR).

Main Results:

  • Achieved a compact die size of 1.81 mm × 1.36 mm.
  • Demonstrated a -15 dB single-ended return loss bandwidth from 2.07 GHz to 4.30 GHz.
  • Reported maximum insertion loss of 2.56 dB, amplitude imbalance < 2.04 dB, phase difference of 180 ± 14.02°, and CMRR > 19.08 dB.

Conclusions:

  • The developed on-chip transformer balun offers significant miniaturization and cost advantages.
  • The balun is suitable for integration into advanced electronic microsystems, including on-package or through-glass interposers (TGIs).
  • This technology enables efficient single-ended to differential conversion, crucial for high-performance integrated circuits.