Investigation on Electromigration-Induced Failure and Reservoir Effect in AlCu Interconnects.

Yuanxiang Zhang1, Guoquan Jiang1,2, Jingbo Zhao1,2

  • 1College of Mechanical Engineering, Quzhou University, Quzhou 324000, China.

Micromachines
|April 26, 2025
PubMed
Summary

Electromigration (EM) is a reliability issue in aluminum-copper (AlCu) interconnects. This study validates the atomic density integral (ADI) method for predicting EM failure, showing reservoirs improve interconnect lifetime up to a critical length.

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