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Updated: Jun 3, 2026

Fabrication of Flexible Image Sensor Based on Lateral NIPIN Phototransistors
Published on: June 23, 2018
A Multimodal CMOS Readout IC for SWIR Image Sensors with Dual-Mode BDI/DI Pixels and Column-Parallel Two-Step
Yuyan Zhang1,2, Zhifeng Chen1, Yaguang Yang3
1School of Opto-Electronic and Communication Engineering, Xiamen University of Technology, Xiamen 361024, China.
Abstract:
This paper proposes a dual-mode CMOS analog front-end (AFE) circuit for short-wave infrared (SWIR) image sensors, which integrates a hybrid readout circuit (ROIC) and a 12-bit two-step single-slope analog-to-digital converter (TS-SS ADC). The ROIC dynamically switches between buffered-direct-injection (BDI) and direct-injection (DI) modes, thus balancing injection efficiency against power consumption. While the DI structure offers simplicity and low power, it suffers from unstable biasing and reduced injection efficiency under high background currents. Conversely, the BDI structure enhances injection efficiency and bias stability via an input buffer but incurs higher power consumption. To address this trade-off, a dual-mode injection architecture with mode-switching transistors is implemented. Mode selection is executed in-pixel via a low-leakage transmission gate and coordinated by the column timing controller, enabling low-current pixels to operate in low-noise BDI mode, whereas high-current pixels revert to the low-power DI mode. The TS-SS ADC employs a four-terminal comparator and dynamic reference voltage compensation to mitigate charge leakage and offset, which improves signal-to-noise ratio (SNR) and linearity. The prototype occupies 2.1 mm × 2.88 mm in a 0.18 µm CMOS process and serves a 64 × 64 array. The AFE achieves a dynamic range of 75.58 dB, noise of 249.42 μV, and 81.04 mW power consumption.
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