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More-than-Moore Approaches Implemented Using van der Waals Heterostructures.

Sangmin Lee1,2, Yeong Kwon Kim3, Jongmin Noh1,2

  • 1SKKU Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University, Suwon 16419, Republic of Korea.

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Summary
This summary is machine-generated.

Two-dimensional materials and van der Waals heterostructures overcome silicon limitations for advanced computing and digital security. Their unique properties enable energy-efficient, multifunctional systems for AI and IoT applications.

Keywords:
In-sensor computingdata-centric computingin-memory computingneuromorphic computingphysical unclonable functions (PUFs)probabilistic computingquantum computingtrue-random number generator (TRNG)two-dimensional materialsvan der Waals heterostructures

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Area of Science:

  • Materials Science
  • Condensed Matter Physics
  • Electrical Engineering

Background:

  • Silicon-based electronics face fundamental limitations in next-generation computing.
  • Two-dimensional (2D) materials and van der Waals (vdW) heterostructures offer unique electronic and physical properties.
  • These materials enable integration of memory, logic, and sensing for compact, energy-efficient systems.

Purpose of the Study:

  • To review the transformative role of 2D materials and vdW heterostructures in computing paradigms.
  • To highlight applications in emerging computing (in-memory, in-sensor, bioinspired, probabilistic, quantum) and digital security (TRNG, PUFs).
  • To discuss how material properties address memory-wall challenges and enable ultralow latency and parallel processing.

Main Methods:

  • Literature review of 2D materials and vdW heterostructures in advanced computing and digital security.
  • Analysis of material properties such as carrier mobility, scalability, spin-orbit coupling, and quantum fluctuations.
  • Examination of device fabrication and integration for scalable, energy-efficient systems.

Main Results:

  • 2D materials and vdW heterostructures are key enablers for next-generation electronic systems.
  • These materials facilitate seamless integration for AI, edge computing, and IoT, overcoming memory-wall challenges.
  • Their properties enhance emerging computing and strengthen entropy-based random number generation and security mechanisms.

Conclusions:

  • Continued progress in materials engineering and device fabrication is crucial for large-scale implementation.
  • 2D materials and vdW heterostructures pave the way for scalable, energy-efficient, and multifunctional computing systems.
  • These advancements are vital for reshaping computing paradigms and enhancing digital security.