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In-Situ Optical Tracking of Electrochemically Growing Metal Interface on Hydrogen Bubble Templated Electrodes
Itishree Panda1, Trina Dhara2, Arkadeep Roy1
1Department of Chemical Engineering, Indian Institute of Technology, Kharagpur, West Bengal 721302, India.
Langmuir : the ACS Journal of Surfaces and Colloids
|August 18, 2025
Summary
Electrode architecture significantly controls metallic electrodeposition patterns. The dynamic hydrogen bubble template (DHBT) method enables precise control over surface morphology for advanced applications.
Area of Science:
- Electrochemistry
- Materials Science
- Surface Science
Background:
- Controlling electrochemical deposition morphology is crucial for nanomanufacturing and energy storage.
- Uniform deposition is key for applications like battery charging.
- Current strategies involve input current, additives, and electrode design.
Purpose of the Study:
- To investigate how electrode architecture influences metallic growth front evolution during electrodeposition.
- To understand the role of microstructured surfaces in controlling deposition patterns.
- To quantify early-stage growth dynamics based on electrode design.
Main Methods:
- Fabrication of electrodes with varied micro-textures (pillars, valleys, porous walls) using the dynamic hydrogen bubble template (DHBT) method.
- Tuning current input (constant and fluctuating) to control DHBT-generated electrode architecture.
- Optical monitoring of metallic electrodeposition on engineered substrates in a two-electrode cell.
- Characterization of deposition height, growth velocity, and surface undulation.
Main Results:
- Electrode architecture, characterized by structure width, height, and density, dictates spatiotemporal evolution of metallic growth fronts.
- The number density of microstructures and interstitial void size significantly influence deposit characteristics.
- Quantitative understanding of early-stage (first few seconds) growth dynamics was achieved.
- The DHBT method allows for tunable micron-scale surface textures for controlled electrodeposition.
Conclusions:
- Base electrode engineering offers a powerful strategy for controlling interfacial topology during electrodeposition.
- Understanding early-stage growth on engineered surfaces is vital for application-specific control in electrochemical systems.
- The DHBT method provides a versatile platform for creating tailored electrode architectures for advanced electrochemical applications.
