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Controlling Schottky Barriers and Tunneling Resistances in Metal/Cu2Se Contacts via van der Waals Interlayers
Xi Geng1, Yufei Xue1, Ruiping Duan1
1Faculty of Materials Science and Engineering, Kunming University of Science and Technology, No. 68 Wenchang Road, Kunming 650093, China.
Abstract:
Electrode contact properties with two-dimensional (2D) channel materials decisively determine the nanodevice's overall performance. A recently synthesized semiconducting Cu2Se monolayer has emerged as a promising candidate for high-performance device channels due to its high carrier mobility, excellent environmental stability, and a reversible thermal-driven phase transition accompanied by a direct-to-indirect band-gap variation. Herein, to identify promising high-quality electrodes for Cu2Se, the contact properties with various metals (Al, Ag, Au, Ni, and Co), as well as the modulation effects of graphene and h-BN interlayers, are systematically investigated based on first-principles calculations. The results demonstrate Ohmic contact formation between Cu2Se and all metals (Al, Ag, Au, Ni, and Co), with tunneling probabilities of 42.84%, 91.67%, 79.89%, 66.89%, and 100%, respectively. Strong interfacial hybridization induces metal-induced gap states (MIGSs), rendering the contact type nontunable with metal work function variations. Intercalating van der Waals interlayers (graphene/h-BN) suppresses MIGSs and enables Schottky barrier tuning. Crucially, at ≥3 interlayers, both metals/Gra/Cu2Se and metals/BN/Cu2Se contacts become independent of the bulk metallic electrodes as interlayer work functions dominate the practical work functions of metals/Gra (BN). Concurrently, tunneling barriers increase with additional interlayers. This work provides theoretical insights into interface engineering strategies for the development of high-performance Cu2Se-based nanodevices.
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