Predictive Wafer-Scale Copper Nanowire Fabrication Using Template-Assisted On-Substrate Electrodeposition

Precisely engineered metallic nanowire arrays offer a compelling solution for advanced electromechanical interconnects at room temperature, crucial for applications ranging from flexible electronics to 3D integrated circuits. However, their widespread adoption has been hindered by complex and costly fabrication methods. This work reports a streamlined and highly scalable route that overcomes these barriers, enabling the growth of uniform nanowire arrays directly on semiconductor substrates. Our method relies on template-assisted electrodeposition within a simple two-electrode plating chamber. A key aspect of this approach is the use of a melamine foam sponge, which applies uniform mechanical pressure to ensure consistent template-substrate contact and promote homogeneous growth. By combining this reliable synthesis with predictive Monte Carlo modeling of the template morphology, we achieve exceptional control over the final array geometry. Using copper as a model system, our charge-based electrodeposition provides excellent control over nanowire length and yields highly reproducible nanowires with diameters tunable from 100 to 1000 nm and a typical length deviation below ∼20% of the target. The practical utility of this method is validated by demonstrating that these arrays form robust and resilient electromechanical chip-to-chip bonding interfaces with excellent adhesion and conductivity. By providing an accessible and low-cost foundation for producing high-quality nanowires, this work significantly expands their potential for immediate use. This opens up future avenues for developing advanced devices, including high-density vertical interconnects, wearable biosensors, and efficient energy harvesting systems.