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Analysis of Key Factors Affecting the Sensitivity of Dual-Backplate Capacitive MEMS Microphones
Chengpu Sun1, Haosheng Liu1, Ludi Kang1
1School of Mechanical & Automobile Engineering, Qingdao University of Technology, No. 777 Jialingjiang Road, Qingdao 266520, China.
Abstract:
This paper presents a comprehensive investigation of sensitivity-determining factors in dual-backplate capacitive MEMS microphones through analytical modeling, finite element analysis (FEM), and experimental validation. The study focuses on three critical design parameters: backplate perforation density, membrane tension, and electrode gap spacing. A lumped parameter model (LPM) and FEM simulations are employed to characterize the dynamic behavior and frequency response of the microphone. Simulation results demonstrate that reducing the backplate hole diameter or hole count amplifies squeeze-film damping, inducing nonlinear effects and anti-resonance dips near the fundamental frequency (f0) while mitigating low-frequency roll-off (<100 Hz). Membrane tension exhibits a nonlinear relationship with sensitivity, stabilizing at high tension (>7000 N/m) but risking pull-in instability at low tension (<1500 N/m). Smaller electrode gaps enhance sensitivity but are constrained by pull-in voltage limitations. The FEM model achieves higher accuracy (≤2 dB error) than LPM in predicting low-frequency response anomalies. This work provides systematic guidelines for optimizing dual-backplate MEMS microphone designs, balancing sensitivity, stability, and manufacturability.
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