Mechanism of a Composite Energy Field for Inhibiting Damage in High-Silicon Aluminum Alloy During Micro-Turning

Composite materials are widely utilized for their excellent properties; however, the mismatch in phase response during processing often induces surface and subsurface damage. While reducing the cutting depth is a common strategy to improve quality, it shifts the material removal mechanism from shear to ploughing-extrusion, which can, in fact, degrade the final surface integrity. Energy field assistance is a promising approach to suppress this issue, yet its underlying mechanism remains insufficiently understood. This study investigates high-silicon aluminum alloy by combining turning experiments with molecular dynamics simulations to elucidate the origin and evolution of damage under different energy fields, establishing a correlation between microscopic processes and observable defects. In conventional turning, damage propagation is driven by particle accumulation and dislocation interlocking. Ultrasonic vibration softens the material and confines plastic deformation to the near-surface region, although excessively high transient peaks can lead to process instability. Laser remelting turning disperses stress within the remelted layer, significantly inhibiting defect expansion, but its effectiveness is highly sensitive to variations in cutting depth. The hybrid approach, laser remelting ultrasonic vibration turning, leverages the dispersion buffering effect of the remelted layer and the localized plastic deformation from ultrasonication to reduce peak loads, control deformation depth, and suppress defects, while simultaneously mitigating the depth sensitivity of damage and maintaining removal efficiency. This work clarifies the mechanism by which a composite energy field controls damage in the micro-cutting of high-silicon aluminum alloy, providing practical guidance for the high-quality machining of composite materials.