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Updated: Jun 25, 2026

Origami Inspired Self-assembly of Patterned and Reconfigurable Particles
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Stamping Lithography on Arbitrary Surfaces based on Self-Assembly of Colloidal Particles.

Guoxu Yu1, Heyang Zhang1, Yiming Li1

  • 1Department of Mechanical Engineering, Tsinghua University, Beijing, 100084, P. R. China.

Advanced Science (Weinheim, Baden-Wurttemberg, Germany)
|November 29, 2025
PubMed
Summary

A novel Stamping Lithography method enables efficient fabrication of 3D circuits on curved surfaces. This technique overcomes limitations of existing methods for conformal electronics and intelligent skins.

Keywords:
3D circuitsmicro/nano manufacturingself‐assemblysoft lithography

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Area of Science:

  • Materials Science
  • Electrical Engineering
  • Nanotechnology

Background:

  • Three-dimensional (3D) circuits are crucial for applications like conformal antennas and intelligent skins.
  • Traditional photolithography struggles with curved surfaces, while transfer printing and additive manufacturing have limitations.
  • Existing methods face challenges with non-developable surfaces, efficiency, and material compatibility.

Purpose of the Study:

  • To introduce a new fabrication method, Stamping Lithography, for creating 3D circuits on arbitrary curved surfaces.
  • To address the limitations of current technologies in manufacturing electronics on non-developable surfaces.
  • To demonstrate a practical strategy for fabricating diverse 3D electronic devices.

Main Methods:

  • Developed Stamping Lithography, combining resist mask stamping via self-assembly of colloidal particles (RSSA) with established etching processes.
  • Utilized RSSA for precise resist patterning on curved substrates.
  • Applied standard etching techniques for circuit definition on various materials.

Main Results:

  • Successfully fabricated 3D circuits on hemispherical substrates, showcasing the method's capability on non-developable surfaces.
  • Demonstrated the fabrication of circuits using diverse materials.
  • Achieved efficient manufacturing of 3D electronics on large-area curved surfaces.

Conclusions:

  • Stamping Lithography offers a practical and versatile solution for fabricating 3D electronics on complex, arbitrary surfaces.
  • This method complements photolithography, expanding possibilities for conformal electronics and advanced device manufacturing.
  • The technique holds significant potential for applications in intelligent skins, metasurfaces, and bionic electronics.