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Soft electronics based on particle engulfment printing.

Rongzhou Lin1,2, Chengmei Jiang3,4,5, Sippanat Achavananthadith3

  • 1School of Mechanical and Automotive Engineering, South China University of Technology, Guangzhou, China.

Nature Electronics
|December 18, 2025
PubMed
Summary
This summary is machine-generated.

Researchers developed a new method to embed functional particles directly into soft polymers for stretchable electronics. This particle engulfment technique simplifies fabrication and enables advanced electronic device capabilities.

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Area of Science:

  • Materials Science
  • Polymer Science
  • Electronics Engineering

Background:

  • Stretchable electronics require integrating functional particles into soft polymer matrices.
  • Current fabrication methods involve liquid dispersions, posing challenges with material compatibility and fluid mechanics control.

Purpose of the Study:

  • To introduce a novel method for direct particle incorporation into soft polymers.
  • To overcome limitations of traditional fabrication techniques for stretchable electronic materials.

Main Methods:

  • Utilizing particle engulfment, where particles are spontaneously subsumed by the polymer matrix driven by surface energy.
  • Ensuring particle size is smaller than the polymer's elastocapillary length for stable embedding.
  • Fabricating multilayered, multimaterial elastic devices.

Main Results:

  • Demonstrated successful direct incorporation of functional particles into soft polymers.
  • Achieved energetically stable configurations with deeply embedded particles.
  • Fabricated functional devices with wireless sensing, communication, and power transfer capabilities.

Conclusions:

  • Particle engulfment offers a simplified and effective approach for fabricating advanced stretchable electronic materials.
  • This method broadens the possibilities for creating complex, integrated electronic devices with enhanced functionalities.