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Updated: Jan 7, 2026

Fabrication of Uniform Nanoscale Cavities via Silicon Direct Wafer Bonding
Published on: January 9, 2014
Deep Strain-Mediated Thermal Transport in Silicon Nanowires
Yanchao Li1, Wencong Shi2, Zhentao Pang3
1Center of Acoustic Functional Materials and Applications, School of Materials Science and Intelligent Engineering, Nanjing University, Suzhou 215163, China.
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The ability to tune thermal transport through strain engineering offers transformative potential for advanced nanodevices, yet the impact of deep elastic strains (>5%) remains largely unexplored due to challenges in experimental implementation. Here we address this gap by developing a MEMS-based platform to probe strain-thermal transport coupling in suspended silicon nanowires. Through applying uniaxial tensile strains up to 5.65%, we observed three distinct regimes: thermal conductivity remains stable below 1% strain, shows slight enhancement before ∼3% strain, then undergoes a dramatic 55% suppression at 5.65% strain, the largest reversible modulation reported in silicon nanostructures. First-principles calculations reveal that the complex interplay between strain-induced phonon group velocity enhancement, scattering rates, and phonon-phonon interactions modulation is the main contributing factor to the nonmonotonic behaviors. This work establishes deep elastic strain as a powerful knob for dynamically controlling thermal transport, with immediate implications for adaptive thermal management in nanoelectronics and high-efficiency thermoelectrics.
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