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High-Efficiency Fiber Edge Coupling for Silicon Nitride Integrated Photonics.

Sergey S Avdeev^1,2, Aleksandr S Baburin^1,2, Evgeniy V Sergeev¹

¹Shukhov Labs, Quantum Park, Bauman Moscow State Technical University, 105005 Moscow, Russia.

|December 31, 2025

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This summary is machine-generated.

This study presents new low-loss coupling strategies for silicon nitride photonics, achieving minimal light loss when connecting fibers to on-chip waveguides. These methods enhance the efficiency of photonic integrated circuits for various applications.

Area of Science:

Photonics and Integrated Circuits
Materials Science

Background:

Photonic integrated circuits (PICs) are vital for modern technologies, including data storage, telecommunications, and computing.
Efficient light coupling between optical fibers and on-chip waveguides is essential for PIC functionality.
Silicon nitride photonics offers advantages but requires optimized coupling solutions.

Purpose of the Study:

To develop and demonstrate low-loss coupling strategies for silicon nitride integrated photonics.
To enable efficient light injection from optical fibers into on-chip waveguides for various applications.
To present optimized designs and fabrication techniques for effective coupling.

Main Methods:

Overview of coupling technologies and optimized designs for inverse tapers.

Keywords:

coupling efficiency edge coupling integrated photonics

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Fabrication of inverse tapers for efficient coupling of transverse-magnetic (TM) and transverse-electric (TE) modes.

Experimental characterization of single-mode waveguides and multi-tip tapers.

Main Results:

Achieved low coupling losses of 0.15 dB per facet for single-mode waveguides using UHNA-7 fiber at 1550 nm.
Designed, fabricated, and characterized a multi-tip taper with 1.5 dB loss per facet.
Demonstrated broadband stability for the multi-tip taper over the 1500-1600 nm range.

Conclusions:

The developed inverse taper approach enables highly efficient, low-loss light coupling for silicon nitride photonics.
The strategy is versatile, applicable to individual fibers, fiber arrays, and chip-to-fiber assembly.
This advancement is crucial for enhancing the performance and integration of PICs in diverse technological fields.