Concurrent In Situ High-Resolution Electron Backscatter Diffraction and Digital Image Correlation for Full-Field...

Area of Science:

• Materials Science
• Mechanical Engineering
• Crystallography

Background:

• Full-field stress and strain data are crucial for understanding microscale material behavior and crystal plasticity.
• Existing methods like digital image correlation (DIC) and high-resolution electron backscatter diffraction (HREBSD) are effective but difficult to combine concurrently.
• Surface preparation for HREBSD is often incompatible with DIC, hindering simultaneous data acquisition.

Purpose of the Study:

• To develop a method for concurrent acquisition of DIC and HREBSD data over the same region.
• To enable precise calibration and validation of crystal plasticity models.
• To investigate the microscale response of additively manufactured polycrystalline Ni superalloys under in situ loading.

Main Methods:

• Microstamping was employed to apply DIC speckling compatible with HREBSD.
• Selective-electron-transparent speckling was applied to an additively manufactured polycrystalline Ni superalloy.
• Concurrent in situ loading experiments were performed, collecting both DIC and HREBSD data from the same area.

Main Results:

• Successfully combined DIC and HREBSD data acquisition on the same sample region.
• Demonstrated the feasibility of the microstamping technique for EBSD-compatible DIC speckling.
• Obtained concurrent microscale stress and strain data during in situ loading.

Conclusions:

• The developed microstamping method overcomes the incompatibility between DIC and HREBSD surface preparation.
• This technique allows for simultaneous measurement of strain and stress at the microscale.
• Enables advanced characterization of material behavior, particularly for additively manufactured alloys.