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Fabrication of Uniform Nanoscale Cavities via Silicon Direct Wafer Bonding
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P-N Nanoporous Silicon Fabrication Using Photoelectrochemical Etching and Ultrasonic Vibration and Liquid-Phase

Chao-Ching Chiang1, Philip Nathaniel Immanuel2

  • 1Department of Mechanical Engineering, Asia Eastern University of Science and Technology, New Taipei City 220303, Taiwan.

Micromachines
|January 28, 2026
PubMed

Keywords:
liquid-phase bondingnanoporous silicon diodephotoelectrochemical etching and ultrasonic vibrationquantum efficiencythermal annealing

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