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Published on: October 5, 2018
Numerical Study on Heat Transfer Performance of Turbulence Enhancement Configurations for Galinstan Based
Fajing Li1, Junxi Han2, Zhifeng Wang2
1Guangzhou Railway Polytechnic, Guangzhou 511300, China.
Efficient thermal management is vital for microelectronics. This study shows that while turbulators improve heat transfer in microchannels, expanded regions can hinder performance, increasing temperatures.
Area of Science:
- Thermal Management
- Microfluidics
- Heat Transfer
Background:
- High heat flux and temperatures in microelectronics reduce reliability.
- Efficient thermal management is essential for stable device operation.
- Liquid metal coolants offer potential for advanced thermal solutions.
Purpose of the Study:
- Investigate flow and heat transfer in microchannel heat sinks with Galinstan.
- Evaluate various turbulator configurations for enhanced thermal performance.
- Analyze the impact of expanded regions on heat transfer.
Main Methods:
- Utilized Galinstan liquid metal as the coolant.
- Simulated microchannel heat sinks with diverse turbulator designs.
- Analyzed flow distribution, heat transfer enhancement, and pressure loss.
Main Results:
- Turbulators creating symmetric flow fields improve distribution in expanded microchannels.
- A long teardrop-shaped turbulator offered the best heat transfer enhancement (13.8-25.9%).
- Expanded regions reduced fluid velocity, increasing bottom surface temperature and degrading overall performance.
Conclusions:
- Turbulator design is critical for microchannel heat sink performance.
- Expanded regions, despite turbulators, can negatively impact thermal management.
- Optimizing microchannel geometry and turbulators is key for effective electronic cooling.
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