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Updated: Jan 29, 2026

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
Published on: March 20, 2015
Yuexin Zhao1, Jingjing Tan1, Lin Chen1,2
1College of Integrated Circuits and Micro-Nano Electronics, Fudan University, Shanghai 200433, China.
This study introduces a new transistor-level technique to reduce aging effects in low-voltage Split-Controlled Flip-Flops (SCFFs). The method significantly improves reliability and reduces timing delays for ultra-low-power applications like IoT devices.
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