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Related Concept Videos

Properties of Transition Metals02:58

Properties of Transition Metals

29.7K
Transition metals are defined as those elements that have partially filled d orbitals. As shown in Figure 1, the d-block elements in groups 3–12 are transition elements. The f-block elements, also called inner transition metals (the lanthanides and actinides), also meet this criterion because the d orbital is partially occupied before the f orbitals.
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Physical and Chemical Properties of Matter02:57

Physical and Chemical Properties of Matter

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The characteristics that enable us to distinguish one substance from another are called properties.
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Bonding in Metals02:32

Bonding in Metals

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Metallic bonds are formed between two metal atoms. A simplified model to describe metallic bonding has been developed by Paul Drüde called the “Electron Sea Model”. 
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Metallic Solids02:37

Metallic Solids

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Metallic solids such as crystals of copper, aluminum, and iron are formed by metal atoms. The structure of metallic crystals is often described as a uniform distribution of atomic nuclei within a “sea” of delocalized electrons. The atoms within such a metallic solid are held together by a unique force known as metallic bonding that gives rise to many useful and varied bulk properties.
All metallic solids exhibit high thermal and electrical conductivity, metallic luster, and malleability....
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Alkali Metals03:06

Alkali Metals

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Group 1 elements are soft and shiny metallic solids. They are malleable, ductile, and good conductors of heat and electricity. The melting points of the alkali metals are unusually low for metals and decrease going down the group, while the density increases going down the group with the exception of potassium (Table 1).
Table 1: Properties of the alkali metals
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Metal-Ligand Bonds02:51

Metal-Ligand Bonds

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The hemoglobin in the blood, the chlorophyll in green plants, vitamin B-12, and the catalyst used in the manufacture of polyethylene all contain coordination compounds. Ions of the metals, especially the transition metals, are likely to form complexes.
In these complexes, transition metals form coordinate covalent bonds, a kind of Lewis acid-base interaction in which both of the electrons in the bond are contributed by a donor (Lewis base) to an electron acceptor (Lewis acid). The Lewis acid in...
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Production of Metal Nanoparticles by Pulsed Laser-ablation in Liquids: A Tool for Studying the Antibacterial Properties of Nanoparticles
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Study on Microstructure and Properties of Micron Copper Powder-Liquid Metal Gallium Composite Interconnect Joint.

Bo Wang1,2, Siliang He2,3, Guopei Zhang4

  • 1East China Institute of Photo-Electron IC, Bengbu 233000, China.

Materials (Basel, Switzerland)
|January 28, 2026
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Summary

Copper-gallium composite paste enables optimized low-temperature transient liquid phase bonding (TLPB) for copper interconnects. This advanced material achieves high electrical conductivity and shear strength, suitable for efficient, high-performance electronic packaging.

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electrical conductivityintermetallic compoundliquid galliumshear strengthtransient liquid phase bonding

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Area of Science:

  • Materials Science
  • Metallurgy
  • Nanotechnology

Background:

  • Low-temperature transient liquid phase bonding (TLPB) using liquid gallium (Ga) offers potential for electronic interconnects.
  • Optimizing the microstructure and joint performance of Ga-based TLPB remains a significant challenge.

Purpose of the Study:

  • To develop and investigate a copper (Cu)-powder/liquid-Ga composite paste for Cu/Cu interconnects.
  • To systematically study the effects of Cu powder particle size and mass fraction on joint properties.

Main Methods:

  • Fabrication of Cu/Ga composite pastes with varying Cu powder particle sizes (10-40 μm) and mass fractions (10-30 wt%).
  • Evaluation of joint microstructure, electrical conductivity, and shear strength under different bonding conditions (temperature, pressure, time).

Main Results:

  • Optimal bonding at 220 °C, 5 MPa, and 720 min yielded a dense intermetallic compound (IMC) microstructure (Cu9Ga4 and CuGa2).
  • Achieved high electrical conductivity (1.1 × 10^7 S·m^-1) and shear strength (52.2 MPa).
  • Even rapid bonding (1 min) resulted in a shear strength of 39.2 MPa.

Conclusions:

  • Adjusting composite paste formulation synergistically optimizes electrical and mechanical properties of Cu-Ga TLPB joints.
  • The developed process demonstrates potential for high-efficiency, short-time interconnection applications in advanced packaging.