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Atomically Precise Interfacial Engineering on Tin-Silicon Oxo Clusters for Sub-8 nm Lithography.

Jian Wei1, Ni Zhen1, Zuohu Zhou1

  • 1Institute of Modern Optics, Tianjin Key Laboratory of Micro-scale Optical Information Science and Technology, Nankai University, Tianjin, P. R. China.

Angewandte Chemie (International Ed. in English)
|February 3, 2026
PubMed
Summary

We developed novel tin oxo clusters (TOCs) functionalized with silane for high-NA EUV lithography. This innovation achieves sub-8 nm patterning with enhanced adhesion, setting a new benchmark for photoresist performance.

Keywords:
interfacial engineeringligands effectmolecular photoresistssub‐8 nm lithographytin‐silicon oxo clusters

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Area of Science:

  • Materials Science
  • Nanotechnology
  • Semiconductor Manufacturing

Background:

  • Tin oxo clusters (TOCs) are promising photoresists for high numerical aperture extreme ultraviolet (High-NA EUV) lithography.
  • Enhancing adhesion between photoresists and substrates is crucial for high-resolution patterning.

Purpose of the Study:

  • To functionalize TOCs with silane moieties to improve adhesion to silicon dioxide substrates.
  • To achieve ultrahigh resolution patterning at the sub-8 nm scale using novel Sn-Si oxo cluster resists.

Main Methods:

  • Surface functionalization of TOCs with silane moieties.
  • High-NA EUV lithography for patterning.
  • Spectroscopic analyses and theoretical calculations to elucidate reaction mechanisms.

Main Results:

  • Successfully achieved sub-8 nm scale patterning, the best performance for TOC photoresists.
  • Demonstrated dual function of Si moieties: capturing secondary electrons and enhancing substrate adhesion.
  • Formation of diverse Sn-O-Sn/Sn-O-Si/Si-O-Si networks leading to higher resolution and lower line-edge roughness (LER).

Conclusions:

  • Introduced a new family of Sn-Si oxo cluster photoresists.
  • Atomic-level interfacial engineering is a viable strategy for next-generation semiconductor manufacturing.
  • The developed resists offer superior resolution and adhesion for advanced lithography applications.