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Mitigating Solidification Cracking in LPBF-Processed K418 Superalloy via Substrate Preheating and Layer Thickness

Deqin Zhao1, Jie Pei1, Chenxue Ma1

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Summary
This summary is machine-generated.

Optimizing laser powder bed fusion (LPBF) of K418 nickel-based superalloys requires specific process parameters. A 350°C substrate preheating temperature effectively minimizes solidification cracking for crack-minimized component manufacturing.

Keywords:
additive manufacturingcrackslaser powder bed fusionnickel-based superalloy

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Area of Science:

  • Materials Science
  • Additive Manufacturing
  • Metallurgy

Background:

  • Solidification cracking is a critical defect in laser powder bed fusion (LPBF) of nickel-based superalloys.
  • K418 nickel-based superalloy is prone to hot cracking during additive manufacturing.
  • Controlling process parameters is essential for achieving high-density, defect-free components.

Purpose of the Study:

  • To systematically investigate the impact of layer thickness and substrate preheating on solidification cracking in LPBF of K418 alloy.
  • To identify optimal process parameters for minimizing hot cracking.
  • To understand the microstructural mechanisms underlying cracking.

Main Methods:

  • Laser Powder Bed Fusion (LPBF) was used to fabricate K418 nickel-based superalloy samples.
  • Varying layer thicknesses (30 μm and 60 μm) and substrate preheating temperatures (200 °C and 350 °C) were employed.
  • Microscopic analysis (e.g., optical microscopy, SEM) was performed to examine crack propagation and microstructural features.
  • Relative density measurements were conducted.

Main Results:

  • A layer thickness of 30 μm with 350 °C preheating and a volumetric energy density (VED) of 60-80 J/mm³ effectively suppressed cracking, achieving >99% relative density.
  • Preheating to 200 °C offered limited crack suppression.
  • At a 60 μm layer thickness, preheating became detrimental, increasing cracking due to thermal accumulation and shrinkage stress.
  • Cracks propagated along high-angle grain boundaries, associated with low-melting-point element segregation (O, B, Si, C).

Conclusions:

  • 350 °C substrate preheating is a crucial parameter for mitigating solidification cracking in LPBF of K418 alloy.
  • Moderate VED combined with optimal preheating and layer thickness enables the production of high-density, crack-minimized K418 components.
  • Understanding the role of thermal stress and grain boundary segregation is key to controlling cracking in LPBF superalloys.