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Ultrathin Amorphous p-Type Tellurium Oxide Films Enabled by Cryogenic Deposition
Taehoon Kim1,2, I K M Reaz Rahman1,2, Inha Kim1,2
1Electrical Engineering and Computer Sciences, University of California, Berkeley, California 94720, United States.
Ultrathin tellurium suboxide (TeOx) films exhibit promising p-type semiconductor properties for advanced electronics. Cryogenic fabrication yields ultrasmooth films with high performance, crucial for next-generation transistors.
Area of Science:
- Semiconductor physics
- Materials science
- Device engineering
Background:
- Amorphous n-type metal oxides like Indium Gallium Zinc Oxide (IGZO) are suitable for back-end-of-line (BEOL) applications.
- A high-performance p-type semiconductor is critical for monolithic 3D integration.
Purpose of the Study:
- To investigate ultrathin tellurium suboxide (TeOx) films for p-type transistors.
- To achieve sub-10 nm TeOx films with acceptable hole mobilities for practical device applications.
Main Methods:
- Fabrication of TeOx transistors using cryogenic thermal evaporation at -80 °C.
- Characterization of film properties, including surface roughness and electrical performance.
- Investigation of selenium alloying for enhanced properties.
Main Results:
- Ultrasmooth TeOx films (RMS roughness as low as 4 Å) achieved via low-temperature processing.
- Back-gated transistors demonstrated an on/off current ratio of 105 and mobility of 2.8 cm2 V-1 s-1 at 5.5 nm thickness.
- Stable p-type switching observed down to 2.4 nm channel thickness. Selenium alloying boosted on/off ratio and allowed bandgap tuning.
Conclusions:
- Cryogenic thermal evaporation enables high-quality ultrathin TeOx films for p-type transistors.
- TeOx shows significant potential as a p-type semiconductor for BEOL applications.
- Selenium alloying offers a pathway for further optimization of TeOx-based devices.
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