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A review of SPAD array chip design for direct time-of-flight LiDAR
Lianghua Mo1,2, Shihua Huang2, Yi Yang1
1School of Integrated Circuits, Tsinghua University, 30 Shuangqing Rd, Beijing, 100084, China.
Discover Nano
|March 17, 2026
Summary
This review details advancements in direct Time-of-Flight (dToF) ranging sensor chips for LiDAR. It covers new ranging methods, interference suppression, accuracy improvements, and Power, Performance, and Area (PPA) optimization.
Area of Science:
- Electrical Engineering
- Optoelectronics
- Sensor Technology
Background:
- Increasing demands for LiDAR performance necessitate advanced receiver chip designs.
- Current LiDAR systems require higher data processing volumes, ranging accuracy, and anti-interference capabilities.
- Significant transformations are occurring in LiDAR receiver chip architecture, data flow, and algorithms.
Purpose of the Study:
- To review the current design status of direct Time-of-Flight (dToF) ranging sensor chips.
- To systematically summarize innovations in ranging methods, anti-interference, accuracy optimization, and PPA design.
- To provide references for future research and development in ToF ranging sensor chips.
Main Methods:
- Review of novel ranging techniques, including histogram-free and variable histogram resolution methods.
- Analysis of anti-interference strategies: ambient light suppression and inter-LiDAR interference mitigation.
- Examination of ranging accuracy calibration methods and comprehensive chip Power, Performance, and Area (PPA) optimization.
Main Results:
- Identified two novel technical schemes for ranging: histogram-free and variable histogram resolution.
- Detailed chip-level approaches for ambient light suppression and inter-LiDAR interference mitigation.
- Highlighted comprehensive design optimization strategies for chip PPA.
Conclusions:
- Direct Time-of-Flight (dToF) sensor chips have seen significant advancements in design.
- Innovations in ranging methods and interference suppression are crucial for meeting LiDAR requirements.
- Further research is needed to address existing design bottlenecks and enhance future ToF sensor chip performance.

