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Updated: Mar 19, 2026

Author Spotlight: Simulation and Analysis of the Temperature Rise of Ring Main Unit Equipment
Published on: July 5, 2024
Hierarchical Modular Architecture Enabling Intelligent Dynamic Thermal Management and Superior Electromagnetic
Qi-Fan Xuan1,2, Pei-Yan Zhao1, Hualong Peng1,2
1State Key Laboratory of Bioinspired Interfacial Materials Science, Bioinspired Science Innovation Center, Hangzhou International Innovation Institute, Beihang University, Hangzhou, 311115, People's Republic of China.
This study presents a new wearable film for intelligent thermal management and electromagnetic interference (EMI) shielding. The advanced film ensures personal health and stable signal transmission in complex environments.
Area of Science:
- Materials Science
- Wearable Technology
- Biomedical Engineering
Background:
- Conventional thermal management lacks environmental awareness and stable human-machine interaction, posing risks to personal health.
- Existing wearable technologies struggle to integrate multiple functionalities effectively for advanced applications.
Purpose of the Study:
- To develop a wearable intelligent thermal management film with robust electromagnetic interference (EMI) shielding capabilities.
- To create a system with sensitive environmental monitoring and efficient thermal regulation for enhanced personal health and device performance.
Main Methods:
- A hierarchical modular design strategy was employed.
- A biomimetic serpentine dual-mode temperature-humidity sensing module was integrated.
- A low-power electro-/photothermal conversion module was coupled for thermal regulation.
Main Results:
- The system demonstrated sensitive temperature-humidity monitoring.
- Achieved low-power electrothermal (51.79°C at 1.5V) and photothermal (56.38°C at 45.51 mW cm⁻²) regulation.
- Exhibited excellent EMI shielding (1600 dB mm⁻¹ at 35 μm thickness).
Conclusions:
- The hierarchical modular design optimizes material performance and functional synergy.
- This scalable approach facilitates multifunctional integration for next-generation wearable electronics.
- The developed film offers a practical solution for advanced wearable thermal management and signal integrity.
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