Imperfections in Crystal Structure: Point, Line and Plane Defects
Lumber Defects
IR Frequency Region: Fingerprint Region
Imperfections in Crystal Structure: Stoichiometric Point Defects
Imperfections in Crystal Structure: Non-Stoichiometric Defects
Detection of Gross Error: The Q Test
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Automatic Laser-based Geometry Capture for Finite Element Analysis of Weld Beads
Published on: July 25, 2025
Yijia Zhang1, Ziyi Ma2, Tongji Cui3
1School of Materials Science and Engineering, Hebei University of Technology, Tianjin 300401, China.
A new FCS-VMamba model improves semiconductor wafer defect classification using Frequency Attention, Cross-Layer Cross-Attention, and Saliency Feature Suppression. This parameter-efficient approach enhances chip manufacturing yield and reliability.
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