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Synergistic Thermal Enhancement of Embedded Micro-Pyramid Array and Advanced Nanofluids for High Heat Dissipation
Yafan Qin1,2, Jingtan Chen1,3, Xing Yang2,4
1State Key Laboratory of Electromechanical Integrated Manufacturing of High-Performance Electronic Equipments, Xidian University, Xi'an 710071, China.
Abstract:
The escalating power density in Active Phased Array Radar has made the thermal management of Transmitter and Receiver (T/R) modules a critical bottleneck for radar performance. To address the thermal resistance of traditional cold plates, this study investigates an innovative embedded cooling strategy utilizing micro-pyramid arrays and advanced nanofluids. Thermal performance was evaluated using maximum temperature, maximum temperature difference and surface temperature standard deviation (ST). Higher pyramid density markedly enhances temperature uniformity, an effect that scales positively with the power load. Under a 100 W condition, the 8-circle micro-pyramids configuration (the densest structure with roughness Ra = 1.3) achieved a 22.58 K reduction in maximum temperature and a 22.5% improvement in temperature uniformity compared to the 2-circle structure, and outperformed the 4-circle structure by 16.98 K and 17.9%, respectively. Furthermore, a comparative analysis of nanofluids (Al2O3, CuO, graphene, and h-BN) is conducted and it is found that graphene nanofluid exhibits the best overall heat transfer enhancement because of its high thermal conductivity and moderate reduction in specific heat capacity. The thermal performance of the nanofluid is evaluated by comparing the maximum temperatures of the heat source at the 8-circle structure. The synergistic coupling of graphene nanofluid with the 8-circle array yields a remarkable 35.38% enhancement in temperature uniformity at 100 W. The enhancement mechanisms are mainly attributed to intrinsic thermophysical properties of the nanoparticles and convection caused by denser pyramid array. The aforementioned findings provide important guidance for the thermal management design of antenna and other high-density integrated electronic systems with embedded cold plate design demand.
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