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Progress and Challenges in Joining for Precision Endoscope Fabrication.

Peiquan Xu1, Xiaohao Zheng1, Leijun Li2

  • 1School of Materials Science and Engineering, Shanghai University of Engineering Science, Shanghai 201620, China.

Sensors (Basel, Switzerland)
|May 13, 2026
PubMed
Summary
This summary is machine-generated.

This review addresses challenges in fabricating reliable endoscope joints by exploring materials, joining methods, and technical issues. It proposes strategies like thin-film engineering and laser-based joining to improve joint integrity and sterilization resistance for minimally invasive surgery devices.

Keywords:
endoscopejoiningminimally invasive surgery (MIS)sealingwelding

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Area of Science:

  • Materials Science and Engineering
  • Biomedical Engineering
  • Manufacturing Processes

Background:

  • Endoscopes are complex multi-material devices requiring robust joining techniques.
  • Current joining methods face challenges with dissimilar materials, residual stress, and sterilization resistance.
  • Degradation of joints can lead to device failure in clinical settings.

Purpose of the Study:

  • To review base materials, joining methods, and technical challenges in endoscope fabrication.
  • To propose strategies for enhancing joint reliability, especially under clinical constraints.
  • To identify solutions for joining dissimilar materials in endoscopes for improved longevity.

Main Methods:

  • Comprehensive literature search across multiple databases (Web of Science, Scopus, PubMed, etc.).
  • Keyword-based retrieval focusing on endoscope joining, welding, sealing, soldering, and brazing.
  • Analysis of 158 selected publications from 1950-2026 on materials, processes, and challenges.

Main Results:

  • Endoscopes utilize diverse materials: biomaterials, optical components, plastics, ceramics, and coatings.
  • Joining techniques include adhesive bonding, laser soldering/brazing, wave soldering, and fusion welding.
  • Key challenges involve joining mismatched materials, reducing residual stress, and resisting sterilization/thermal degradation.

Conclusions:

  • Synergistic thin-film engineering with silver anti-oxidation layers can improve joint hermeticity and reduce stress.
  • Developing principles for multi-joining processes is crucial for integrating dissimilar materials.
  • Laser-based joining offers precision control for heat input and bonding quality, minimizing damage to sensitive components.