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Updated: May 24, 2026

Ohmic Contact Fabrication Using a Focused-ion Beam Technique and Electrical Characterization for Layer Semiconductor Nanostructures
Published on: December 5, 2015
Enhanced electrical performance of tellurium FETs via ultra-thin atomic-layer-deposited Al2O3interlayer for
Yeongeun Kwon1,2, Seyoung Oh1,2, Ojun Kwon1,2
1Department of Advanced Materials Engineering, Chungbuk National University, Chungdae-ro 1, Seowon-Gu, Cheongju, Chungbuk 28644, Republic of Korea.
Abstract:
In this study, we demonstrate that an atomic-layer-deposited Al2O3dielectric interlayer uniformly covering both the channel and contact regions effectively reduces the Schottky barrier height (SBH) of tellurium (Te) field-effect transistors (FETs), providing a facile strategy to mitigate Fermi-level pinning. An ultrathin 3 nm Al2O3interlayer inserted between the metal electrode and Te channel leads to significantly better electrical performance than that of Te FETs with channel-only Al2O3passivation. Specifically, the drain current density increases by a factor of 2.5, while the hysteresis window of the threshold voltage is reduced from 14.4 to 8.1 V. Transmission line measurements reveal a substantial decrease in contact resistance from 23.9 to 1.47 MΩ·μm, which is attributed to the reduction in SBH from 133 to 49 meV. These results highlight the importance of simultaneous channel and contact interface engineering and establish the Al2O3interlayer as an effective approach for realising reliablep-type Te FETs.
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