A Double-Layer Parallel MEMS Inductor with Enhanced Current-Carrying Capacity and Thermal Stability

As a core component in electronic circuits, the size of inductors is crucial for the thin-film integration and miniaturization of circuits. Although various miniaturized inductors have been fabricated by using integrated circuit technology, their low current-carrying capacity and small inductance values cannot meet current application requirements. Therefore, this paper designs an inductor chip based on a double-layer parallel (DLP) array microcoil structure. Experimental verification demonstrates that the developed DLP inductor exhibits a far superior rated energy storage capability per unit area compared to other single-layer inductors, along with excellent thermal performance. Meanwhile, the 4 × 3 DLP array can withstand a maximum DC current of 4.25 A. This structural innovation provides a meaningful thermal-electromagnetic co-design reference solution for highly reliable integrated power modules.