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Related Experiment Video

Updated: Jul 4, 2026

Fabrication of Gate-tunable Graphene Devices for Scanning Tunneling Microscopy Studies with Coulomb Impurities
11:42

Fabrication of Gate-tunable Graphene Devices for Scanning Tunneling Microscopy Studies with Coulomb Impurities

Published on: July 24, 2015

Wafer-scale robust graphene electronics under industrial processing conditions.

E P van Geest1,2, B S Can1,2, M Makurat1,2

  • 1Leiden Institute of Chemistry, Leiden University, Einsteinweg 55, 2333CC, Leiden, The Netherlands. g.f.schneider@chem.leidenuniv.nl.

Chemical Communications (Cambridge, England)
|July 3, 2026
PubMed
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This summary is machine-generated.

A new pyrene-based adhesion layer prevents graphene delamination in electronic devices. This covalent method ensures graphene's stability in harsh industrial processes, improving semiconductor manufacturing yields.

Area of Science:

  • Materials Science
  • Nanotechnology
  • Semiconductor Manufacturing

Background:

  • Graphene integration in commercial electronics is hindered by delamination issues, especially in aqueous environments.
  • Graphene delamination during wafer processing limits its use in the semiconductor industry.
  • Developing robust adhesion strategies for graphene on silicon wafers is critical.

Purpose of the Study:

  • To develop a facile method for enhancing graphene adhesion to silicon wafers.
  • To ensure graphene's compatibility with harsh semiconductor industrial processes.
  • To improve device yield and performance using graphene.

Main Methods:

  • Synthesis of a covalent pyrene-based adhesion layer in a two-step procedure.
  • Testing graphene adhesion under various harsh conditions: acidic/alkaline solutions, organic solvents, and sonication.

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  • Fabrication and testing of electronic devices on 4-inch silicon wafers.

    • Main Results:

    • The pyrene-based adhesion layer effectively prevented graphene delamination via π-π interactions.
    • Graphene adhesion was maintained under challenging acidic, alkaline, solvent, and sonication conditions.
    • High measurement yield (up to 99.7%) and reproducible device-to-device performance were achieved.

    Conclusions:

    • A robust covalent adhesion strategy using pyrene derivatives enables stable graphene integration in semiconductor manufacturing.
    • This method overcomes graphene delamination issues, paving the way for reliable graphene-based electronic devices.
    • The facile synthesis and proven efficacy offer a scalable solution for industrial applications.