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Fabrication of High-Resolution 3D Ceramic Electronics Via In Situ Laser-Activated Selective Electroless Plating
Peiren Wang1,2, Xiaoyi Chen1, Hanqiang Zhang1
1Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing, China.
Advanced Materials (Deerfield Beach, Fla.)
|July 18, 2026
Summary
Researchers developed a hybrid 3D printing method for custom ceramic electronics. This technique enables rapid, cost-effective fabrication of high-performance components for demanding applications.
Area of Science:
- Materials Science
- Additive Manufacturing
- Ceramic Engineering
Background:
- Customized 3D ceramic electronics offer superior thermal, electrical, and mechanical properties for advanced systems.
- Tailoring structural and functional designs is crucial for specialized applications.
Purpose of the Study:
- To propose and validate a hybrid additive manufacturing approach for high-precision 3D ceramic electronics.
- To demonstrate the fabrication of functional 3D ceramic electronic components.
Main Methods:
- A hybrid approach combining digital light processing and in situ laser-activated electroless plating.
- Development of a photopolymer with low-temperature co-fired ceramic (LTCC) and antimony tin oxide (ATO).
- Selective laser activation of ATO to Sn(II) for subsequent electroless copper and nickel immersion gold plating.
Main Results:
- Successful fabrication of high-precision 3D ceramic electronics.
- Demonstrated feasibility and scalability through the creation of 3D circuits with IC chips, high-power LED circuits with thermal management, and 3D UV sensors.
- Validated the conversion of ATO into Sn(II) plating seeds for metallization.
Conclusions:
- The proposed hybrid additive manufacturing technology provides a novel pathway for rapid, cost-effective customization of 3D ceramic electronics.
- This technology shows significant promise for applications in aerospace, automotive systems, and wireless communication in harsh environments.
