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Fabrication of Three-Dimensional Microstructures on SiC Substrates by Using 355 nm Nanosecond Lasers: Process Control
Hsin-Yi Tsai1,2, Yu-Hsuan Lin1, Kuo-Cheng Huang1
1National Center for Instrumentation Research, National Institutes of Applied Research, Hsinchu 300092, Taiwan.
Micromachines
|July 28, 2026
Summary
UV laser processing enables direct-write fabrication of 3D silicon carbide (SiC) microstructures for thermal management. This method optimizes material removal and surface quality for complex SiC micro-devices.
Area of Science:
- Materials Science
- Microfabrication
- Laser Processing
Background:
- Silicon carbide (SiC) offers excellent thermal properties but is challenging to 3D microfabricate due to hardness and brittleness.
- Existing methods struggle with creating complex 3D SiC structures for applications like power device thermal management.
Purpose of the Study:
- To develop and optimize a UV nanosecond laser direct-write process for fabricating 3D SiC microstructures.
- To establish a workflow for achieving high surface quality and geometric fidelity in SiC micropillar arrays.
Main Methods:
- Utilized UV nanosecond laser irradiation for dry, direct-write processing of SiC via vaporization.
- Investigated key process variables: pulse repetition frequency, laser power, scan repetitions per layer, and Z-direction focal shifts.
- Developed a strategy to balance material removal depth, sidewall verticality, and top-surface roughness.
Main Results:
- High repetition frequency improved sidewall verticality but increased top-surface roughness.
- A strategy of fewer Z-shifts and more scan repetitions per layer mitigated errors and improved roughness.
- Achieved a balance between removal depth, sidewall verticality, and top-surface roughness in fabricated micropillar arrays.
Conclusions:
- The study provides practical guidelines for direct-write 3D microstructuring of hard materials like SiC.
- The developed laser processing approach offers potential for rapid fabrication of chip-level heat dissipation microstructures.
- This method can reduce manufacturing costs and increase design flexibility for 3D thermal management architectures.
