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Updated: Aug 5, 2026

Thermal Measurement Techniques in Analytical Microfluidic Devices
Published on: June 3, 2015
Additively Manufactured Ring-Type Thermal Sensor for In-Pipe Flow Monitoring in a Marine Engineering Context: Design
Dimitrios Nikolaos Pagonis1, Christos Liosis2, Antonis Vailas1
1Naval Architecture Department, University of West Attica, 12243 Athens, Greece.
Abstract:
This work presents the design evolution, fabrication, and characterisation of an additively manufactured ring-type thermal airflow sensor for in-pipe flow monitoring, developed employing exclusively Fused Deposition Modelling (FDM) additive manufacturing technology and a commercially available Carbon Nanotube (CNT)-enriched Biopolymer Polylactic Acid (PLA) composite filament. The design evolution proceeds through three progressive stages. In the first stage, a flat heater element is characterised through Constant-Current (CC) Joule heating experiments in order to derive the corresponding Temperature Coefficient of Resistance (TCR) and Thermal Resistance from the obtained experimental data. Consequently, a Finite Element Method (FEM) model implemented in COMSOL Multiphysics® and calibrated with the extracted material parameters validates the experimental temperature-power relationship and predicts the convective cooling behaviour at various airflow velocities. In the second stage, the geometry is optimised by introducing a conductive trace with a reduced-cross-section central region; as a result, an equivalent thermal localisation is achieved at approximately 26% lower supplied power with respect to the initial heating element, enabled by the design freedom inherent in the FDM process. We should note that the specific sensing geometry can also be directly embedded into any 3D-printed structural component (e.g., a bracket or housing), enabling simultaneous local thermal heating and/or thermal monitoring together with structural functionality within a single printed part. In the third and final stage-the target device-a fully monolithic ring-type airflow sensor is directly integrated into a 3D-printed pipe segment during the printing process. Under constant-current excitation at 40 mA, the device exhibits a monotonically decreasing resistance with increasing airflow (ΔR ≈ 117 Ω over 0-4 m/s) due to convective cooling, while in a single flow-interruption cycle, approximately 79% of the flow-induced resistance change was recovered upon flow removal, with a residual offset of approximately 3% of the heated baseline. A coupled electrothermal FEM model of the device further supports the experimental response by comparing the simulated temperature rise with the values inferred from resistance measurements, while also clarifying the role of the effective internal convective cooling conditions imposed by the pipe geometry. Key features of the proposed device are low raw-consumables cost, fast on-site manufacturing employing a commercially available desktop 3D printer, monolithic construction free of wire-bonded interconnections, and simplicity, indicating its potential for flow monitoring and condition-based maintenance systems aboard vessels as well as in a wide range of industrial sectors. We should note that the present characterisation was performed under laboratory conditions employing a single prototype per design stage; the effects of humidity, salt exposure, vibration, temperature cycling, and material-batch variability remain to be assessed prior to shipboard deployment.
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