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Updated: Aug 9, 2026

Fabrication of Micro-Patterned Chip with Controlled Thickness for High-Throughput Cryogenic Electron Microscopy
Published on: April 21, 2022
Cell micropatterning using an indium-tin-oxide patterned microarray chip
Hidetaka Ueno1, Shohei Yamamura2
1Center for Advanced Medical Engineering Research & Development (CAMED), Kobe University, 1-5-1 Minatojima-minamimachi, Chuo-ku, Kobe, Hyogo, 650-0047, Japan.
Abstract:
Cell micropatterning is an essential technology for elucidating intercellular crosstalk and the behavior of single cells and cell populations. However, conventional micropatterning methods based on chemically modified cell-adhesive and nonadhesive surfaces face significant challenges. These methods involve challenges in optimizing substrate surfaces for culturing different cell types and exhibit variations in micropatterning precision. In this study, we propose a novel cell micropatterning method using an indium-tin-oxide (ITO) patterned microarray chip in combination with ultraviolet C (UVC, 254 nm) irradiation. By exposing an ITO microarray chip with adhered cells to UVC light, U-87 cells on the ITO layer proliferated to form a cell layer. Simultaneously, contact between adjacent cell layers was prevented, resulting in the formation of independent U-87 cell layers with the same geometry as the ITO layer. This method allows structurally unrestricted cell culture on a flat surface and free coating of the culture surface with materials that are most suitable for cell culture and eliminates the need for additional processes such as temperature control or voltage application during micropatterning. Furthermore, because the process does not rely on cell-adhesive or nonadhesive chemical factors, which vary significantly among cell types, it is expected to provide consistent performance across diverse cell species. Therefore, the proposed method enables the construction of optimal, low-stress cell culture environments on a simple planar platform without requiring specialized microstructures or adhesion factors.

