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Ben Kaczer

Showing results (1-10 of 8) with videos related to

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Micromachines|June 27, 2024
An In-Depth Study of Ring Oscillator Reliability under Accelerated Degradation and Annealing to Unveil Integrated Circuit UsageJavier Diaz-Fortuny, Pablo Saraza-Canflanca, Erik Bury, et al.
Micromachines|July 8, 2020
Correlated Time-0 and Hot-Carrier Stress Induced FinFET Parameter Variabilities: Modeling ApproachAlexander Makarov, Philippe Roussel, Erik Bury, et al.
Advanced Materials (Deerfield Beach, Fla.)|March 23, 2022
Perspective of 2D Integrated Electronic Circuits: Scientific Pipe Dream or Disruptive Technology?Michael Waltl, Theresia Knobloch, Konstantinos Tselios, et al.
Micromachines|December 31, 2025
Incorporation of Temperature Impact on Hot-Carrier Degradation into Compact Physics ModelStanislav Tyaginov, Erik Bury, Alexander Grill, et al.
Micromachines|November 25, 2023
Compact Physics Hot-Carrier Degradation Model Valid over a Wide Bias RangeStanislav Tyaginov, Erik Bury, Alexander Grill, et al.
Micromachines|September 28, 2021
Understanding the Origin of Metal Gate Work Function Shift and Its Impact on Erase Performance in 3D NAND Flash MemoriesSivaramakrishnan Ramesh, Arjun Ajaykumar, Lars-Åke Ragnarsson, et al.
ACS Applied Materials & Interfaces|October 28, 2024
Experimental-Modeling Framework for Identifying Defects Responsible for Reliability Issues in 2D FETsLuca Panarella, Stanislav Tyaginov, Ben Kaczer, et al.
Micromachines|August 26, 2023
Impact of Nitridation on Bias Temperature Instability and Hard Breakdown Characteristics of SiON MOSFETsStanislav Tyaginov, Barry O'Sullivan, Adrian Chasin, et al.
Pageof 1

Showing results (1-10 of 8) with videos related to

Sort By:
Pageof 1
Micromachines|June 27, 2024
An In-Depth Study of Ring Oscillator Reliability under Accelerated Degradation and Annealing to Unveil Integrated Circuit UsageJavier Diaz-Fortuny, Pablo Saraza-Canflanca, Erik Bury, et al.
Micromachines|July 8, 2020
Correlated Time-0 and Hot-Carrier Stress Induced FinFET Parameter Variabilities: Modeling ApproachAlexander Makarov, Philippe Roussel, Erik Bury, et al.
Advanced Materials (Deerfield Beach, Fla.)|March 23, 2022
Perspective of 2D Integrated Electronic Circuits: Scientific Pipe Dream or Disruptive Technology?Michael Waltl, Theresia Knobloch, Konstantinos Tselios, et al.
Micromachines|December 31, 2025
Incorporation of Temperature Impact on Hot-Carrier Degradation into Compact Physics ModelStanislav Tyaginov, Erik Bury, Alexander Grill, et al.
Micromachines|November 25, 2023
Compact Physics Hot-Carrier Degradation Model Valid over a Wide Bias RangeStanislav Tyaginov, Erik Bury, Alexander Grill, et al.
Micromachines|September 28, 2021
Understanding the Origin of Metal Gate Work Function Shift and Its Impact on Erase Performance in 3D NAND Flash MemoriesSivaramakrishnan Ramesh, Arjun Ajaykumar, Lars-Åke Ragnarsson, et al.
ACS Applied Materials & Interfaces|October 28, 2024
Experimental-Modeling Framework for Identifying Defects Responsible for Reliability Issues in 2D FETsLuca Panarella, Stanislav Tyaginov, Ben Kaczer, et al.
Micromachines|August 26, 2023
Impact of Nitridation on Bias Temperature Instability and Hard Breakdown Characteristics of SiON MOSFETsStanislav Tyaginov, Barry O'Sullivan, Adrian Chasin, et al.
Pageof 1