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Haojie Dang

Showing results (1-10 of 8) with videos related to

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Micromachines|January 8, 2025
The Deformation of a Liquid Metal Droplet Under Continuous Acceleration in a Variable Cross-Section GrooveHanyang Xu, Haojie Dang, Wenchao Tian, et al.
Journal of Molecular Modeling|August 6, 2025
Atomic-scale theoretical investigation into the role of metal passivation layers in lowering Cu-Cu bonding temperatureHaojie Dang, Wenchao Tian, Yongkun Wang, et al.
Micromachines|August 29, 2024
Reliability Simulation Analysis of TSV Structure in Silicon Interposer under Temperature CyclingWenchao Tian, Haojie Dang, Dexin Li, et al.
Micromachines|September 23, 2022
Effects of Side Profile on Acoustic Streaming by Oscillating Microstructures in ChannelLin Lin, Haojie Dang, Rongxin Zhu, et al.
Micromachines|February 27, 2026
Influence of Inlet Splitter Structure on Flow and Heat Transfer Performance in Microchannel Heat ExchangersWenchao Tian, Yuanyuan Xi, Shuaike Li, et al.
Micromachines|October 26, 2024
Progress in Research on Co-Packaged OpticsWenchao Tian, Huahua Hou, Haojie Dang, et al.
Micromachines|May 4, 2026
Correction: Xi et al. Influence of Inlet Splitter Structure on Flow and Heat Transfer Performance in Microchannel Heat Exchangers. <i>Micromachines</i> 2026, <i>17</i>, 275Yuanyuan Xi, Si Chen, Wenchao Tian, et al.
Micromachines|September 28, 2024
Residual Stress and Warping Analysis of the Nano-Silver Pressureless Sintering Process in SiC Power Device PackagingWenchao Tian, Dexin Li, Haojie Dang, et al.
Pageof 1

Showing results (1-10 of 8) with videos related to

Sort By:
Pageof 1
Micromachines|January 8, 2025
The Deformation of a Liquid Metal Droplet Under Continuous Acceleration in a Variable Cross-Section GrooveHanyang Xu, Haojie Dang, Wenchao Tian, et al.
Journal of Molecular Modeling|August 6, 2025
Atomic-scale theoretical investigation into the role of metal passivation layers in lowering Cu-Cu bonding temperatureHaojie Dang, Wenchao Tian, Yongkun Wang, et al.
Micromachines|August 29, 2024
Reliability Simulation Analysis of TSV Structure in Silicon Interposer under Temperature CyclingWenchao Tian, Haojie Dang, Dexin Li, et al.
Micromachines|September 23, 2022
Effects of Side Profile on Acoustic Streaming by Oscillating Microstructures in ChannelLin Lin, Haojie Dang, Rongxin Zhu, et al.
Micromachines|February 27, 2026
Influence of Inlet Splitter Structure on Flow and Heat Transfer Performance in Microchannel Heat ExchangersWenchao Tian, Yuanyuan Xi, Shuaike Li, et al.
Micromachines|October 26, 2024
Progress in Research on Co-Packaged OpticsWenchao Tian, Huahua Hou, Haojie Dang, et al.
Micromachines|May 4, 2026
Correction: Xi et al. Influence of Inlet Splitter Structure on Flow and Heat Transfer Performance in Microchannel Heat Exchangers. <i>Micromachines</i> 2026, <i>17</i>, 275Yuanyuan Xi, Si Chen, Wenchao Tian, et al.
Micromachines|September 28, 2024
Residual Stress and Warping Analysis of the Nano-Silver Pressureless Sintering Process in SiC Power Device PackagingWenchao Tian, Dexin Li, Haojie Dang, et al.
Pageof 1