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Foods (Basel, Switzerland)|December 23, 2022
Conditions of the Stepwise Cooling Algorithm for Stable Supercooling Preservation and Freshness of Pork LoinDong Hyeon Park, Eun Jeong Kim, Honggyun Kim, et al.
Nanotechnology|January 10, 2024
<i>In-situ</i>temperature-dependent sheet resistance study of Cu films in oxygen ambient for heterogeneous integrationsVijay D Chavan, Honggyun Kim, Kyeong-Keun Choi, et al.
Korean Journal for Food Science of Animal Resources|May 5, 2018
The Change in Quality Characteristics of Hanwoo in Home Meal Replacement Products under Different Cooking and Freezing MethodsHonggyun Kim, Dong Hyeon Park, Geun-Pyo Hong, et al.
Scientific Reports|December 20, 2019
Tuning of ionic mobility to improve the resistive switching behavior of Zn-doped CeO<sub>2</sub>Shania Rehman, Honggyun Kim, Muhammad Farooq Khan, et al.
Nanomaterials (Basel, Switzerland)|February 4, 2021
Stable and Multilevel Data Storage Resistive Switching of Organic Bulk HeterojunctionHarshada Patil, Honggyun Kim, Shania Rehman, et al.
ACS Applied Materials & Interfaces|October 25, 2023
Self-Assembled Monolayer Doping for MoTe<sub>2</sub> Field-Effect Transistors: Overcoming PN Doping Challenges in Transition Metal DichalcogenidesDong Hyun Lee, Muhammad Rabeel, Youngmin Han, et al.
Journal of Colloid and Interface Science|January 24, 2026
Interface-engineered Gd₂O₃/ZrO₂ bilayer memristor for emulating synaptic plasticity in neuromorphic systemsHammad Ghazanfar, Muhammad Rabeel, Sobia Nisar, et al.
Nanoscale|July 24, 2025
2D material-based infrared photodetectors: recent progress, challenges, and perspectivesMuhammad Wajid Zulfiqar, Sobia Nisar, Ghulam Dastgeer, et al.
Nanomaterials (Basel, Switzerland)|October 14, 2023
Thermal, Mechanical, and Electrical Stability of Cu Films in an Integration Process with Photosensitive Polyimide (PSPI) FilmsRuhan E Ustad, Vijay D Chavan, Honggyun Kim, et al.
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