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Micromachines|May 4, 2026
Rapid and High-Fidelity Fabrication of Embedded Elastomeric Photomask for Wafer-Scale Sub-Micrometer Conformal Contact PhotolithographyHuikang Liang, Bingquan Lei, Zhiwen Shu, et al.
The Review of Scientific Instruments|May 3, 2020
Development of a symmetrical micro-beam minimizing horizontal drift for indentation and scratchPengfei Shi, Huikang Liang, Wenmeng Yan, et al.
ACS Applied Materials & Interfaces|January 3, 2022
Asymmetric Nanofractures Determined the Nonreciprocal Peeling for Self-Aligned Heterostructure Nanogaps and DevicesZhiwen Shu, Yiqin Chen, Zhanyong Feng, et al.
Nanotechnology|November 16, 2022
Suspended 3D metallic dimers with sub-10 nm gap for high-sensitive SERS detectionPei Zeng, Yuting Zhou, Zhiwen Shu, et al.
ACS Nano|August 23, 2024
Phase-Change Stamp with Highly Switchable Adhesion and Stiffness for Damage-Free Multiscale Transfer PrintingLei Chen, Huikang Liang, Peng Liu, et al.
Advanced Materials (Deerfield Beach, Fla.)|June 8, 2023
Dry-Transferable Photoresist Enabled Reliable Conformal Patterning for Ultrathin Flexible ElectronicsLei Chen, Peng Liu, Bo Feng, et al.
Nanomaterials (Basel, Switzerland)|June 10, 2023
Wafer-Level Highly Dense Metallic Nanopillar-Enabled High-Performance SERS Substrates for Molecular DetectionPei Zeng, Mengjie Zheng, Hao Chen, et al.
Nanotechnology|February 11, 2021
Fabrication of single-nanometer metallic gaps via spontaneous nanoscale dewettingPei Zeng, Zhiwen Shu, Shi Zhang, et al.
ACS Applied Materials & Interfaces|May 31, 2023
Programmable Nanoscale Crack Lithography for Multiscale PMMA PatternsZhiwen Shu, Fuhua Ye, Peng Liu, et al.
Advanced Materials (Deerfield Beach, Fla.)|November 26, 2024
Sustainable Lithography Paradigm Enabled by Mechanically Peelable ResistsLei Chen, Huikang Liang, Peng Liu, et al.
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